Device Provides Up To 40 Percent Space Savings and Increased Efficiency
Fürstenfeldbruck – December 12, 2011 – Designers of mobile products routinely face the challenge of reducing space as well as improving efficiency in every aspect of their design. In devices that use a one-cell Li-Ion battery pack, such as ultraportable applications, this is an area of particular importance.
To help designers meet the challenge of reducing design space and increasing efficiency, Fairchild Semiconductor (NYSE:FCS), a leading global supplier of high performance power and mobile products, developed the FDMB2307NZ PowerTrench® MOSFET. This device provides the increased efficiency needed in a form factor that significantly reduces design space.
Designed specifically for Li-Ion battery pack protection circuits and other ultraportable applications, the FDMB2307NZ features dual N-channel common drain MOSFETs, enabling bidirectional current flow.
By using advanced PowerTrench processes, the FDMB2307NZ provides high power density and a maximum Rss(on) of 16.5m? at VGS = 4.5V, ID = 8A, resulting in lower conduction losses, lower voltage drop, less power dissipation and increased overall design efficiency when compared to competitive solutions. The FDMB2307NZ also provides excellent thermal performance, resulting in cooler system operation, further increasing efficiency.
The device“s 2x3mm2MicroFET? package provides designers with one of the smallest MLP solutions available – 40 percent smaller than existing legacy solutions – saving significant board space in their design. RoHS-compliant, the device also provides HBM ESD protection >2kV.
By integrating leading circuit technologies into tiny, advanced packages, Fairchild Semiconductor provides mobile users significant advantages while reducing the size, cost and power of designs. Fairchild“s mobile IP can be found in a majority of mobile devices in use today.
Fairchild Semiconductor: Solutions for Your Success?
Price: US $0.46 in 1,000 quantity pieces
Availability: Samples available upon request.
Delivery: 8-12 weeks ARO
Contact Information:
To contact Fairchild Semiconductor about this product, please go to: http://www.fairchildsemi.com/cf/sales_contacts/.
For information on other products, design tools and sales contacts, please visit: http://www.fairchildsemi.com.
Note to Editor: For a datasheet in PDF format, please go to:
http://www.fairchildsemi.com/ds/FD/FDMB2307NZ.pdf
About Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) – global presence, local support, smart ideas. Fairchild delivers energy-efficient, easy-to-use and value-added semiconductor solutions for power and mobile designs. We help our customers differentiate their products and solve difficult technical challenges with our expertise in power and signal path products. Please contact us on the web at http://www.fairchildsemi.com/.
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Editorial Contacts:
Lucy Turpin Communications
Birgit Fuchs-Laine
Tel.: 089-41 77 61 13
Email: fairchild.eu@lucyturpin.com
Kontakt:
Fairchild Semiconductor
Birgit Fuchs-Laine
Oskar-von-Miller-Str. 4e
82256 Fürstenfeldbruck
089-417761-13
http://www.fairchildsemi.com/
fairchild.eu@lucyturpin.com
Pressekontakt:
Lucy Turpin Communications
Birgit Fuchs-Laine
Prinzregentenstr. 79
81675 München
fairchild.eu@lucyturpin.com
089-417761-13
http://www.lucyturpin.com